China TC-PX30 Development Kit Carrier Board For Stamp Hole Manufacturers & Suppliers

Rockchip TC-PX30 Development Board(TC-PX30 Development Kit carrier Board )

1.TC-PX30 Development Kit Carrier Board For Stamp Hole Introduction
Rockchip TC-PX30 Development Board(TC-PX30 Development Kit carrier Board )
TC-PX30 development board consists of TC-PX30 stamp hole SOM and carrier board.

TC-PX30 system on module is based on Rockchip PX30 64 bit quad-core A35 processor. The frequency is up to 1.3GHz. Integrated with ARM Mali-G31 graphics processor, supports OpenGL ES3.2, Vulkan 1.0，OpenCL2.0, 1080p 60fts, H.264 and H.265 video decoding. It is designed with 1GB/2GB LPDDR3, 8GB/16GB/32GB eMMC,

TC-PX30 carrier board Interfaces: 4G LTE, OTG, USB2.0, 100M Ethernet, WIFI, bluetooth, audioideo input/output , G-Sensor, RGB display, LVDS/MIPI display, MIPI camera, TF card slot, extended GPIO.

It supports Android8.1, Linux and Ubuntu OS. Source code are open.

thinkcore’s open source platform core boards and development boards.thinkcore’s full suite of hardware and software customization services solutions based on Rockchip socs supports the customer’s design process, from the earliest development stages to successful mass production.

Board Design Services
Building a tailored carrier board according to customers’ requirements
Integration of our SoM in the end user’s hardware for cost reduction and lower footprint and shorten development cycle

Software Development Services
Firmware, Device Drivers, BSP, Middleware
Porting to different development environments
Integration to target platform

Manufacturing Services
Procurement of components
Production quantity builds
Custom labeling
Complete turn-key solutions

Embedded R & D
Technology
– Low level OS: Android and Linux, to bring up Geniatech hardware
– Driver porting: For customized hardware, building the hardware working in the OS level
– Security and authentic tool: To ensure the hardware is working in the correct way

2.TC-PX30 Development Kit Carrier Board For Stamp Hole Parameter (Specification)

Parameters
Appearance			Stamp hole SOM + carrier board
Size			185.5mm*110.6mm
Layer			SOM6-layer/carrier board 4-layer
System Configuration
CPU	Rockchip PX30,Quad core A35 1.3GHz
RAM	Default 1GB LPDDR3, 2GB optional
EMMC	4GB/8GB/16GB/32GB emmc optional，default 8GB
Power IC	RK809
Interfaces parameters
Display		RGB, LVDS/MIPI
Touch		I2C/USB
Audio		AC97/IIS,support record and play
SD		1channel SDIO
Ethernet		100M
USB HOST		3 channel HOST2.0
USB OTG		1 channel OTG2.0
UART		2channel uart,support flow control uart
PWM		1channel PWMoutput
IIC		4channel IICoutput
IR		1
ADC		1 channel ADC
Camera		1channel MIPI CSI
4G		1slot
WIFI/BT		1
GPIO		2
Power Input		2 slot, 12V
RTC Power Input		1 slot
Power Output		12V/5V/3.3V

3.TC-PX30 Development Kit Carrier Board For Stamp Hole Feature And Application
Rockchip TC-PX30 Development Board(TC-PX30 Development Kit carrier Board )
TC-PX30 SOM Features:
● Powerful functions, rich interfaces, wide applications.
● Supports Android8.1, Linux, Ubuntu OS. Source code are open.
● Size is only 185.5mm*110.6mm,a stable and reliable board for products.
Application scenario
TC-PX30 is suitable for AIOT quipment,vehicle control,game equipment,commercial display equipment,medical equipment,vending machines,industrial computers,etc.

4.TC-PX30 Development Kit Carrier Board For Stamp Hole Details
SOM Appearance

Rockchip TC-PX30 Development Board(TC-PX30 Development Kit carrier Board ) Appearance

Rockchip TC-PX30 Development Board(TC-PX30 Development Kit carrier Board )
PIN Definition

No.#	Signal	No.#	Signal
1	GPIO0_A5	19	LCDC_VSYNC
2	I2C1_SCL	20	LCDC_DEN
3	I2C1_SDA	21	LCDC_D0
4	GPIO0_B4	22	LCDC_D1
5	PWM1	23	LCDC_D2
6	VCC3V3_LCD	24	LCDC_D3
7	LVDS_TX0N	25	LCDC_D4
8	LVDS_TX0P	26	LCDC_D5
9	LVDS_TX1N	27	LCDC_D6
10	LVDS_TX1P	28	LCDC_D7
11	LVDS_CLKN	29	LCDC_D8
12	LVDS_CLKP	30	LCDC_D9
13	LVDS_TX2N	31	LCDC_D10
14	LVDS_TX2P	32	LCDC_D11
15	LVDS_TX3N	33	LCDC_D12
16	LVDS_TX3P	34	LCDC_D13
17	LCDC_CLK	35	LCDC_D14
18	LCDC_HSYNC	36	LCDC_D15
No.#	Signal	No.#	Signal
37	LCDC_D16	55	SDIO_CLK
38	LCDC_D17	56	SDIO_CMD
39	LCDC_D18	57	SDIO_D3
40	LCDC_D19	58	SDIO_D2
41	LCDC_D20	59	GPIO0_B3
42	LCDC_D21	60	GPIO0_B2
43	LCDC_D22	61	GPIO0_A1
44	LCDC_D23	62	GPIO2_B0
45	GPIO0_B5	63	GPIO0_A2
46	GPIO2_B4	64	I2C0_SCL_PMIC
47	GPIO0_A0	65	I2C0_SDA_PMIC
48	UART1_CTS	66	PDM_CLK0
49	UART1_RXD	67	I2S1_SDO
50	UART1_TXD	68	I2S1_SDI
51	UART1_RTS	69	I2S1_LRCK
52	CLKOUT_32K	70	I2S1_SCLK
53	SDIO_D1	71	I2S1_MCLK
54	SDIO_D0	72	GND
No.#	Signal	No.#	Signal
73	MIC2_IN	91	GPIO2_B6
74	MIC1_IN	92	I2C2_SDA
75	HP_SNS	93	I2C2_SCL
76	HPR	94	MIPI_CLKO
77	HPL	95	VCC2V8_DVP
78	SPKP_OUT	96	VCC1V8_DVP
79	SPKN_OUT	97	RMII_RST
80	GND	98	RMII_CLK
81	MIPI_CSI_D3N	99	MAC_MDC
82	MIPI_CSI_D3P	100	RMII_MDIO
83	MIPI_CSI_D2N	101	RMII_RXDV
84	MIPI_CSI_D2P	102	RMII_RXER
85	MIPI_CSI_CLKN	103	RMII_RXD1
86	MIPI_CSI_CLKP	104	RMII_RXD0
87	MIPI_CSI_D1P	105	RMII_TXD0
88	MIPI_CSI_D1N	106	RMII_TXD1
89	MIPI_CSI_D0P	107	RMII_TXEN
90	MIPI_CSI_D0N	108	GND
No.#	Signal	No.#	Signal
109	VCC5V0_SYS	127	FLASH_WRN
110	VCC5V0_SYS	128	FLASH_CS1
111	GND	129	FLASH_RDN
112	GND	130	SDMMC0_D2
113	EXT_EN	131	SDMMC0_D3
114	VCC5V0_HOST	132	SDMMC0_CMD
115	VCC_RTC	133	VCC_SD
116	VCC3V3_SYS	134	SDMMC0_CLK
117	VCC3V0_PMU	135	SDMMC0_D0
118	VCC_1V8	136	SDMMC0_D1
119	OTG_DP	137	SDMMC0_DET
120	OTG_DM	138	RESET_KEY
121	USB_ID	139	POWER_KEY
122	USB_DET	140	ADC0
123	USB_HOST_DM	141	ADC1
124	USB_HOST_DP	142	ADC2
125	FLASH_CS0	143	IR_IN / PWM3
126	FLASH_CLE	144	GPIO0_B7

Development Board Hardware Interfaces Description

TC-PX30 development board

Interfaces details
NO.#	Name	Description
【1】	12V IN	12V Power input
【2】	RTC Bat	RTC Power input
【3】	RST Key	Reset key
【4】	Update Key	Update key
【5】	Func Key	Function key
【6】	PWR Key	Power key
【7】	IR	IR receive
【8】	CSI Cam	MIPI CSI camera
【9】	MIPI/LVDS	MIPI/LVDS display
【10】	RGB LCD	RGB display
【11】	G-sensor	G-sensor
【12】	TF slot	TF card slot
【13】	SIM slot	4G SIM Card slot
【14】	Exteral & Trace Ant	Wifi/BT antenna, including onboard and socket
【15】	WIFI/BT	WIFI/BT module AP6212
【16】	4G Module	PCIE 4G module slot
【17】	GPIO	GPIO expansion
【18】	UART3	Uart3，ttl level
【19】	Debug Com	Debug UART
【20】	Power Out	Power output
【21】	LED	LED control by GPIO
【22】	MIC	Audio input
【23】	SPK	speaker output
【24】	HeadPhone	Audio earphone output
【25】	ETH RJ45	100M Ethernet RJ45
【26】	USB2.0 X 3	3*USB2.0 HOST TypeA
【27】	OTG	OTG mini USB
【28】	TC-PX30 Core Board	TC-PX30 SOM

5.TC-PX30 Development Kit Carrier Board For Stamp Hole Qualification
The production plant has Yamaha imported automatic placement lines, German Essa selective wave soldering, solder paste inspection 3D-SPI, AOI, X-ray, BGA rework station and other equipment, and has a process flow and strict quality control management. Ensure the reliability and stability of the core board.

6.Deliver,Shipping And Serving
The ARM platforms currently launched by our company include RK (Rockchip) and Allwinner solutions. RK solutions include RK3399, RK3288, PX30, RK3368, RV1126, RV1109, RK3568; Allwinner solutions include A64; product forms include core boards, development boards, industrial control motherboards, industrial control integrated boards and complete products. It is widely used in commercial display, advertising machine, building monitoring, vehicle terminal, intelligent identification, intelligent IoT terminal, AI,Aiot,industry, finance, airport, customs, police, hospital, home smart, education, consumer electronicsetc.etc.

Thinkcore’s open source platform core boards and development boards.thinkcore’s full suite of hardware and software customization services solutions based on Rockchip socs supports the customer’s design process, from the earliest development stages to successful mass production.

Board Design Services
Building a tailored carrier board according to customers’ requirements
Integration of our SoM in the end user’s hardware for cost reduction and lower footprint and shorten development cycle

Software Development Services
Firmware, Device Drivers, BSP, Middleware
Porting to different development environments
Integration to target platform

Manufacturing Services
Procurement of components
Production quantity builds
Custom labeling
Complete turn-key solutions

Embedded R & D
Technology
– Low level OS: Android and Linux, to bring up Geniatech hardware
– Driver porting: For customized hardware, building the hardware working in the OS level
– Security and authentic tool: To ensure the hardware is working in the correct way

Software and hardware information
The core board provides schematic diagrams and bit number diagrams, the development board bottom board provides hardware information such as PCB source files, software SDK package open source, user manuals, guide documents, debugging patches, etc.

7.FAQ
1. Do you have support? What kind of technical support is there?
Thinkcore reply: We provide the source code, schematic diagram, and technical manual for the core board development board.
Yes, technical support, you can ask questions via email or forums.

The scope of technical support
1. Understand what software and hardware resources are provided on the development board
2. How to run the provided test programs and examples to make the development board run normally
3. How to download and program the update system
4. Determine whether there is a fault. The following issues are not within the scope of technical support, only technical discussions are provided
⑴. How to understand and modify the source code, self-disassembly and imitation of circuit boards
⑵. How to compile and transplant the operating system
⑶. Problems encountered by users in self-development, that is, user customization problems
Note: We define "customization" as follows: In order to realize their own needs, users design, make or modify any program codes and equipment by themselves.

2. Can you accept orders?
Thinkcore replied:
Services we provide: 1. System customization; 2. System tailoring; 3. Drive development; 4. Firmware upgrade; 5. Hardware schematic design; 6. PCB Layout; 7. System upgrade; 8. Development environment construction; 9. Application debugging method; 10. Test method. 11. More customized services┉

3. What details should be paid attention to when using the android core board?
Any product, after a period of use, will have some small problems of this kind or that. Of course, the android core board is no exception, but if you maintain and use it properly, pay attention to the details, and many problems can be solved. Usually pay attention to a little detail, you can bring yourself a lot of convenience! I believe you will definitely be willing to try. .

First of all, when using the android core board, you need to pay attention to the voltage range that each interface can accept. At the same time, ensure the matching of the connector and the positive and negative directions.

Secondly, the placement and transportation of the android core board is also very important. It needs to be placed in a dry, low-humidity environment. At the same time, it is necessary to pay attention to anti-static measures. In this way, the android core board will not be damaged. This can avoid the corrosion of the android core board due to high humidity.

Third, the internal parts of the android core board are relatively fragile, and heavy beating or pressure can cause damage to the internal components of the android core board or PCB bending. and so. Try not to let the android core board be hit by hard objects during use

4. How many types of packages are generally available for ARM embedded core boards?
The ARM embedded core board is an electronic motherboard that packs and encapsulates the core functions of a PC or tablet. Most ARM embedded core boards integrate CPU, storage devices and pins, which are connected to the supporting backplane through pins to realize a system chip in a certain field. People often call such a system a single-chip microcomputer, but it should be more accurately referred to as an embedded development platform.

Because the core board integrates the common functions of the core, it has the versatility that a core board can customize a variety of different backplanes, which greatly improves the development efficiency of the motherboard. Because the ARM embedded core board is separated as an independent module, it also reduces the difficulty of development, increases the reliability, stability and maintainability of the system, accelerates time to market, professional technical services, and optimizes product costs. Loss of flexibility.

The three main characteristics of the ARM core board are: low power consumption and strong functions, 16-bit/32-bit/64-bit dual instruction set and numerous partners. Small size, low power consumption, low cost, high performance; support Thumb (16-bit)/ARM (32-bit) dual instruction set, compatible with 8-bit/16-bit devices; a large number of registers are used, and the instruction execution speed is faster ; Most data operations are completed in registers; the addressing mode is flexible and simple, and the execution efficiency is high; the instruction length is fixed.

Si Nuclear Technology's AMR series embedded core board products make good use of these advantages of the ARM platform. Components CPU CPU is the most important part of the core board, which is composed of arithmetic unit and controller. If the RK3399 core board compares a computer to a person, then the CPU is his heart, and its important role can be seen from this. No matter what kind of CPU, its internal structure can be summarized into three parts: control unit, logic unit and storage unit.

These three parts coordinate with each other to analyze, judge, calculate and control the coordinated work of various parts of the computer.

Memory Memory is a component used to store programs and data. For a computer, only with memory can it have a memory function to ensure normal operation. There are many types of storage, which can be divided into main storage and auxiliary storage according to their use. Main storage is also called internal storage (referred to as memory), and auxiliary storage is also called external storage (referred to as external storage). External storage is usually magnetic media or optical disks, such as hard disks, floppy disks, tapes, CDs, etc., which can store information for a long time and do not rely on electricity to store information, but driven by mechanical components, the speed is much slower than that of the CPU.

Memory refers to the storage component on the motherboard. It is the component that the CPU directly communicates with and uses it to store data. It stores the data and programs currently in use (that is, in execution). Its physical essence is one or more groups. An integrated circuit with data input and output and data storage functions. The memory is only used to temporarily store programs and data. Once the power is turned off or there is a power failure, the programs and data in it will be lost.

There are three options for the connection between the core board and the bottom board: board-to-board connector, gold finger, and stamp hole. If the board-to-board connector solution is adopted, the advantage is: easy plugging and unplugging. But there are the following shortcomings: 1. Poor seismic performance. The board-to-board connector is easily loosened by vibration, which will limit the application of the core board in automotive products. In order to fix the core board, methods such as glue dispensing, screwing, soldering copper wire, installing plastic clips, and buckling the shielding cover can be used. However, each of them will expose many shortcomings during mass production, resulting in an increase in the defect rate.

2. Cannot be used for thin and light products. The distance between the core board and the bottom plate has also increased to at least 5mm, and such a core board cannot be used to develop thin and light products.

3. The plug-in operation is likely to cause internal damage to the PCBA. The area of the core board is very large. When we pull out the core board, we must first lift one side with force, and then pull out the other side. In this process, the deformation of the core board PCB is inevitable, which may lead to welding. Internal injuries such as point cracking. Cracked solder joints will not cause problems in the short term, but in long-term use, they may gradually become poorly contacted due to vibration, oxidation and other reasons, forming an open circuit and causing system failure.

4. The defective rate of patch mass production is high. Board-to-board connectors with hundreds of pins are very long, and small errors between the connector and the PCB will accumulate. In the reflow soldering stage during mass production, internal stress is generated between the PCB and the connector, and this internal stress sometimes pulls and deforms the PCB.

5. Difficulty in testing during mass production. Even if a board-to-board connector with a 0.8mm pitch is used, it is still impossible to directly contact the connector with a thimble, which brings difficulties to the design and manufacture of the test fixture. Although there are no insurmountable difficulties, all the difficulties will eventually be manifested as an increase in cost, and the wool must come from the sheep.

If the gold finger solution is adopted, the advantages are: 1. It is very convenient to plug and unplug. 2. The cost of gold finger technology is very low in mass production.

The disadvantages are: 1. Since the gold finger part needs to be electroplated gold, the price of the gold finger process is very expensive when the output is low. The production process of the cheap PCB factory is not good enough. There are many problems with the boards and the product quality cannot be guaranteed. 2. It cannot be used for thin and light products like board-to-board connectors. 3. The bottom board needs a high-quality notebook graphics card slot, which increases the cost of the product.

If the stamp hole scheme is adopted, the disadvantages are: 1. It is difficult to disassemble. 2. The core board area is too large, and there is a risk of deformation after reflow soldering, and manual soldering to the bottom board may be required. All the shortcomings of the first two schemes no longer exist.

5. Will you tell me the delivery time of the core board?
Thinkcore replied: Small batch sample orders, if there is stock, the payment will be shipped within three days. Large quantities of orders or customized orders can be shipped within 35 days under normal circumstances

TC-PX30 Development Kit Carrier Board For Stamp Hole

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